During its annual Foundry Forum event, Samsung gave us an update on what’s coming out of its foundries in the future. For starters, Samsung is set to begin producing 3nm chips in the first half of 2022, with second-gen 3nm chips coming in 2023. Moreover, it also stated that mass-production of its 2nm process is expected to start in 2025.
Samsung’s upcoming process nodes will take advantage of the company’s GAA technology and Multi-Bridge-Channel FET. The first manufacturing process to use this will be the first generation Samsung 3nm node, which delivers a 35% decrease in size, 30% higher performance or 50% lower power consumption compared to its 5nm node. At the moment, the 3nm node’s logic yield is close to the company’s 4nm node, which is already being mass-produced.
Scheduled to release in the first half of 2022, the first-gen 3nm process node will be followed by a second-generation that is expected to come out in 2023. Following that, Samsung is hoping to start mass-producing 2nm chips in 2025.
During its keynote, Samsung also assured that it will keep investing in its FinFET process technology. Although its 14nm FinFET process node is already a few years old, Samsung is still improving it, adding support for 3.3V high voltage or flash-type embedded MRAM, offering increased write speeds and density.
KitGuru says: Due to the ongoing chip shortage, some companies were forced to use older process technologies as an alternative. This alone justifies why Samsung keeps improving and investing in older nodes. Nonetheless, it looks like Samsung is still heavily investing in process node advancements, as seen by its 3nm and 2nm plans.
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